The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Oct. 15, 2019
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Lawrence Selvaraj Susai, Singapore, SG;

Chor Shu Cheng, Singapore, SG;

Yong Chau Ng, Singapore, SG;

Lulu Peng, Singapore, SG;

Zishan Ali Syed Mohammed, Singapore, SG;

Nuraziz Yosokumoro, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 23/31 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01L 23/3157 (2013.01); H01L 23/645 (2013.01);
Abstract

A semiconductor device may include: a substrate; a protective region provided over the substrate; and a core structure enclosed by the protective region. The core structure may include a core material etchable by a chemical solution. The protective region may include a protective material resistant to etching by the chemical solution. The core structure may have a first side and a second side opposite to the first side, the first side being closer to the substrate than the second side. The core structure may be narrowest at the first side of the core structure.


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