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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12068324 B1

PDFFull Text
Date of Patent:
Aug. 20, 2024

Filed:

Jun. 25, 2021

Multi-die fine grain integrated voltage regulation

Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Jared L. Zerbe, Woodside, CA (US);

Emerson S. Fang, Fremont, CA (US);

Jun Zhai, San Jose, CA (US);

Shawn Searles, Austin, TX (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:

Kowert, Hood, Munyon, Rankin & Goetzel, P.C.

Gareth M. Sampson

Primary Examiner:

Michelle Mandala

Assistant Examiner:

Kevin undefined Quinto

Int. Cl.
CPC ...
H01L 27/10 (2006.01); H01G 4/228 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01); H01L 25/18 (2023.01); H01L 49/02 (2006.01); H01L 23/50 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 27/101 (2013.01); H01G 4/228 (2013.01); H01L 23/13 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/642 (2013.01); H01L 24/14 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 28/40 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 25/105 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1088 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/157 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/19104 (2013.01);
Abstract

A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.

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