The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Mar. 06, 2023
Applicant:

Socionext Inc., Kanagawa, JP;

Inventors:

Atsushi Okamoto, Yokohama, JP;

Hirotaka Takeno, Yokohama, JP;

Wenzhen Wang, Yokohama, JP;

Assignee:

SOCIONEXT INC., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/50 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/50 (2013.01); H01L 23/5384 (2013.01); H01L 27/088 (2013.01);
Abstract

A semiconductor integrated circuit device includes first and second semiconductor chips stacked one on top of the other. First power supply lines in the first semiconductor chip are connected with second power supply lines in the second semiconductor chip through a plurality of first vias. The directions in which the first power supply lines and the second power supply lines extend are orthogonal to each other.


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