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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12068213 B1

PDFFull Text
Date of Patent:
Aug. 20, 2024

Filed:

Nov. 22, 2021

Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereof

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Thai Kee Gan, Melaka, MY;

Sanjay Kumar Murugan, Melaka, MY;

Ralf Otremba, Kaufbeuren, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/296 (2013.01); H01L 23/3121 (2013.01); H01L 23/373 (2013.01); H01L 23/4951 (2013.01); H01L 23/49524 (2013.01); H01L 23/49575 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/84 (2013.01); H01L 2224/3702 (2013.01);
Abstract

A chip package including a semiconductor chip is provided. The chip package may include a packaging material at least partially around the semiconductor chip with an opening extending from a top surface of the packaging material to the semiconductor chip and/or to an electrical contact structure contacting the semiconductor chip, and a thermally conductive material in the opening, wherein the thermally conductive material is configured to transfer heat from the semiconductor chip to an outside, wherein the thermally conductive material extends laterally at least partially over the top surface of the packaging material.

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Gan, Thai. (2024). Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereof (U.S. Patent No. 12068213). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12068213

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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