The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Jun. 30, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Robert Allan Neidorff, Bedford, NH (US);

Sreenivasan K Koduri, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/067 (2006.01); G01R 31/28 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
G01R 1/06711 (2013.01); G01R 31/2851 (2013.01); H01L 23/4952 (2013.01);
Abstract

A semiconductor device includes a leadframe having a first level and a second level. The semiconductor device includes a semiconductor die and a conductive alloy. The conductive alloy is between the semiconductor die and the first level of the lead frame. The conductive alloy is configured to be a current sense element. The semiconductor device further includes a first conductive post coupling the semiconductor die to the conductive alloy, a second conductive post coupling the semiconductor die to the conductive alloy, and a third conductive post coupling the semiconductor die to the second level of the lead frame. The second conductive post is configured to be a first sense terminal. The third conductive post is configured to be a second sense terminal.


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