The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Aug. 11, 2020
Applicant:
Showa Denko K.k., Tokyo, JP;
Inventors:
Akira Furuya, Tokyo, JP;
Tadaaki Kojima, Tokyo, JP;
Hiroshi Suzuki, Tokyo, JP;
Fumiaki Naka, Tokyo, JP;
Assignee:
Resonac Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); C25D 5/14 (2006.01); C25D 5/50 (2006.01);
U.S. Cl.
CPC ...
B32B 15/013 (2013.01); B32B 15/017 (2013.01); B32B 15/018 (2013.01); C25D 5/14 (2013.01); C25D 5/50 (2013.01);
Abstract
A laminate including a metallic base material, a first nickel-containing plating film layer formed on the metallic base material, a gold plating film layer formed on the first nickel-containing plating film layer, a second nickel-containing plating film layer formed on the gold plating film layer, and a nickel fluoride film layer formed on the second nickel-containing plating film layer. Also disclosed is a method for producing the laminate as well as a constituent member of a semiconductor production device including the laminate.