The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Nov. 05, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Koichi Motoyama, Clifton Park, NY (US);

Chanro Park, Clifton Park, NY (US);

Hsueh-Chung Chen, Cohoes, NY (US);

Chih-Chao Yang, Glenmont, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); H01L 21/76816 (2013.01); H01L 21/7684 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01);
Abstract

Provided is a semiconductor device and corresponding method of fabricating the same. The semiconductor device comprises a plurality of bottom lines. One or more top vias are arranged on top of the plurality of bottom lines. One or more electronic fuses (eFuses) are also arranged on top of the plurality of bottom lines. Each eFuse of the one or more eFuses is a via having a smaller critical dimension that the one or more top vias. A plurality of top lines are arranged on top of the one or more top vias and the one or more eFuses.


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