The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Jan. 24, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Hsiao-Chun Chang, Hukou Township, TW;

Guan-Jie Shen, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823821 (2013.01); H01L 21/823807 (2013.01); H01L 21/823878 (2013.01); H01L 27/0924 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01);
Abstract

A method of manufacturing a semiconductor device includes disposing two or more fins each having an initial fin profile on a substrate. A sacrificial oxide layer is grown on a first fin and a second fin of the two or more fins. The sacrificial oxide layer of the first and second fins is etched to trim the fin and to generate a next fin profile for the first and second fins. The growing and etching is repeated to trim the first and second fins such that the number of repetitions for the first fin and the second fin are different. Gate structures are formed over the two or more fins.


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