The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Jun. 10, 2021
Applicant:
United Microelectronics Corp., Hsinchu, TW;
Inventors:
Ching-Pei Lin, Hsinchu County, TW;
Ming-Tsung Yeh, Taipei, TW;
Chuan-Guei Wang, Yunlin County, TW;
Ji-Fu Kung, Taichung, TW;
Assignee:
UNITED MICROELECTRONICS CORP, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 18/2134 (2023.01); G06F 18/2137 (2023.01); G06N 5/04 (2023.01); G06V 20/62 (2022.01);
U.S. Cl.
CPC ...
G06F 18/21345 (2023.01); G06F 18/2137 (2023.01); G06N 5/04 (2013.01); G06V 20/635 (2022.01);
Abstract
A manufacturing data analyzing method and a manufacturing data analyzing device are provided. The manufacturing data analyzing method includes the following steps. Each of at least one numerical data, at least one image data and at least one text data is transformed into a vector. The vectors are gathered to obtain a combined vector. The combined vector is inputted into an inference model to obtain a defect cause and a modify suggestion.