The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Apr. 27, 2022
Applicant:

Jentek Sensors, Inc., Marlborough, MA (US);

Inventors:

Todd Dunford, Amherst, MA (US);

Neil Goldfine, Cocoa Beach, FL (US);

Stuart Chaplan, Marlborough, MA (US);

Assignee:

JENTEK Sensors, Inc., Marlborough, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/90 (2021.01); G01N 27/904 (2021.01); G01R 33/09 (2006.01);
U.S. Cl.
CPC ...
G01N 27/904 (2013.01); G01N 27/9006 (2013.01); G01R 33/091 (2013.01);
Abstract

A system and method are provided for inspecting challenging material locations such as holes. The system may include a sensor cartridge ('mandrel') for hole inspection that has a helical portion to which a sensor array is attached. The radius of the helical portion can be increased or decreased by applying a torque to the helical portion thereby allowing the sensor to be inserted into a hole or pressed against the wall of the hole. A scanner is described to which mandrels can be quickly connected and changed enabling an inspector to quickly switch between different mandrels (e.g., for different holes sizes and sensor configurations). Also disclosed is an inspection procedure and data processing algorithm for performing an inspection. The data processing algorithm utilizes a signature library for enhancing the detection or sizing of features of interest such as cracks. The algorithm and library can account for material edges, various material types.


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