The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Aug. 05, 2021
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Hiroki Kigami, Osaka, JP;

Kenji Onishi, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/35 (2018.01); B81B 7/00 (2006.01); C09J 133/08 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0029 (2013.01); C09J 7/35 (2018.01); C09J 133/08 (2013.01); C09J 2203/326 (2013.01); C09J 2301/304 (2020.08); C09J 2301/312 (2020.08); H01L 2924/1461 (2013.01); Y10T 428/2891 (2015.01);
Abstract

A provided protective cover member is a protective cover member configured to be placed on a face of an object, the face having an opening. The protective cover member includes a laminate, and the laminate includes: a protective membrane having a shape configured to cover the opening when the member is placed on the face; and an adhesive agent layer. The adhesive agent layer includes a thermosetting adhesive layer including a thermosetting resin composition. The thermosetting resin composition has a storage modulus of 1×10Pa or more at 130 to 170° C. The above protective cover member is suitable for reducing deformation thereof and/or peeling thereof from a placement face in a high-temperature treatment such as reflow soldering.


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