The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Mar. 31, 2021
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
An-Hsuan Hsu, Taoyuan, TW;
Yung-Sheng Lin, Taoyuan, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/62 (2006.01); H01R 12/52 (2011.01); H01R 12/57 (2011.01); H01R 43/02 (2006.01); H05K 3/36 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H01R 4/625 (2013.01); H01R 12/52 (2013.01); H01R 12/57 (2013.01); H01R 43/02 (2013.01); H05K 3/368 (2013.01); H05K 3/108 (2013.01); H05K 2203/0723 (2013.01);
Abstract
A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first substrate, a second substrate, and a solid solution layer. The first substrate includes a first metal layer, and the first metal layer includes a first metal. The second substrate includes a second metal layer. The solid solution layer electrically connects the first metal layer to the second metal layer. The solid solution layer includes a first metal-rich layer.