The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Feb. 05, 2020
Mitsubishi Electric Corporation, Tokyo, JP;
Kazunari Nakata, Tokyo, JP;
Kensuke Taguchi, Tokyo, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
A power semiconductor device includes a termination region having a corner and an element region inside the termination region. An SiC substrate spans the element region and the termination region. An interlayer insulating film has an outer edge in the termination region. A source electrode is in contact with the SiC substrate in the element region, and has an outer edge on the interlayer insulating film in the termination region. An insulating protective film covers the outer edge of the interlayer insulating film and the outer edge of the source electrode, and has an inner edge on the source electrode. At the corner of the termination region, the outer edge of the interlayer insulating film has a radius of curvature R, and the inner edge of the insulating protective film has a radius of curvature R. The radius of curvature Ris greater than the radius of curvature R