The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Jan. 07, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chien-Hsien Kuo, Hsinchu, TW;

Hon-Lin Huang, Hsinchu, TW;

Han-Yi Lu, Hsinchu, TW;

Ching-Wen Hsiao, Hsinchu, TW;

Alexander Kalnitsky, San Francisco, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 41/04 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01F 17/0013 (2013.01); H01F 17/0033 (2013.01); H01F 17/04 (2013.01); H01F 41/046 (2013.01); H01F 2017/0086 (2013.01);
Abstract

An inductor includes a core and a conductive spiral wound around the core. The core includes a buffer layer, an etch stop layer, and a core material layer sequentially stacked. The core material layer includes a ferromagnetic material. A total area of a vertical projection of the core material layer is smaller than an area occupied by the etch stop layer. The vertical projection of the core material layer falls entirely on the etch stop layer. The etch stop layer horizontally protrudes with respect to the core material layer.


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