The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Aug. 06, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventor:

Shyam Surthi, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/535 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H10B 41/27 (2023.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
H01L 23/535 (2013.01); H01L 21/76895 (2013.01); H01L 23/5283 (2013.01); H01L 23/53266 (2013.01); H10B 41/27 (2023.02); H10B 43/27 (2023.02);
Abstract

Some embodiments include an integrated assembly having a stack of alternating first and second levels. A panel extends through the stack. The first levels have proximal regions adjacent the panel, and have distal regions further from the panel than the proximal regions. The distal regions have first conductive structures, and the proximal regions have second conductive structures. Detectable interfaces are present where the first conductive structures join to the second conductive structures. Some embodiments include methods of forming integrated assemblies.


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Surthi, Shyam. (2024). Integrated assemblies and methods of forming integrated assemblies (U.S. Patent No. 12057400). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12057400

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