The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Nov. 30, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Bhargav Citla, Fremont, CA (US);

Chentsau Ying, Cupertino, CA (US);

Srinivas Nemani, Sunnyvale, CA (US);

Viachslav Babayan, Sunnyvale, CA (US);

Michael Stowell, Loveland, CO (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01J 37/32 (2006.01); H01L 21/311 (2006.01); H01L 21/3115 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67069 (2013.01); H01J 37/32146 (2013.01); H01J 37/32706 (2013.01); H01L 21/31116 (2013.01); H01L 21/3115 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01L 21/68735 (2013.01); H01J 2237/334 (2013.01); H01L 21/3105 (2013.01);
Abstract

Semiconductor systems and methods may include methods of performing selective etches that include modifying a material on a semiconductor substrate. The substrate may have at least two exposed materials on a surface of the semiconductor substrate. The methods may include forming a low-power plasma within a processing chamber housing the semiconductor substrate. The low-power plasma may be a radio-frequency ('RF') plasma, which may be at least partially formed by an RF bias power operating between about 10 W and about 100 W in embodiments. The RF bias power may also be pulsed at a frequency below about 5,000 Hz. The methods may also include etching one of the at least two exposed materials on the surface of the semiconductor substrate at a higher etch rate than a second of the at least two exposed materials on the surface of the semiconductor substrate.


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