The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Apr. 09, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Cheng-Ming Lin, Yunlin County, TW;

Hao-Ming Chang, Pingtung, TW;

Chih-Ming Chen, Taoyuan, TW;

Chung-Yang Huang, Chiayi County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/44 (2012.01); G03F 1/42 (2012.01); G03F 1/48 (2012.01);
U.S. Cl.
CPC ...
G03F 1/44 (2013.01); G03F 1/42 (2013.01); G03F 1/48 (2013.01);
Abstract

A circuit layout patterning method includes: receiving a photomask substrate including a shielding layer; defining a chip region and a peripheral region adjacent to the chip region; forming a design pattern in the chip region; forming a reference pattern by emitting one first radiation shot and a beta pattern by emitting a plurality of second radiation shots in the peripheral region, wherein a pixel size of the first radiation shot is greater than a pixel size of the second radiation shot; comparing a width of the reference pattern and a width of the beta pattern; transferring the design pattern to the shielding layer if a difference between the width of the reference patterned and the width of the beta pattern is within a tolerance; and transferring the design pattern of the photomask to a semiconductor substrate.


Find Patent Forward Citations

Loading…