The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Jun. 22, 2021
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Shunsaku Yoshikawa, Tokyo, JP;
Takashi Saito, Tokyo, JP;
Yuuki Iijima, Tokyo, JP;
Kanta Dei, Tokyo, JP;
Takahiro Matsufuji, Tokyo, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 35/02 (2006.01); C22C 13/02 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/025 (2013.01); C22C 13/02 (2013.01); B23K 2101/36 (2018.08);
Abstract
A solder alloy comprises Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, and a balance Sn.