The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Dec. 06, 2021
Applicant:

R&d Circuits, South Plainfield, NJ (US);

Inventor:

Donald Eric Thompson, Freemont, CA (US);

Assignee:

Advantest America, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2006.01); C25D 3/38 (2006.01); C25D 5/02 (2006.01); C25D 7/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 3/426 (2013.01); C25D 3/38 (2013.01); C25D 5/02 (2013.01); C25D 7/00 (2013.01); H05K 1/0222 (2013.01); H05K 1/182 (2013.01); H05K 3/0047 (2013.01); H05K 3/368 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10409 (2013.01); H05K 2203/0723 (2013.01);
Abstract

The present invention provides a novel method of constructing a coax spring-pin socket that furnishes better performance and is easier to manufacture in volume using common dielectrics and copper plating. This is accomplished by, in application, a lamination of PCB dielectric layers. This dielectric block is then drilled, plated, etched, and drilled in steps for the construction of a coaxial structure for the signal pins, and a ground structure for ground pins. This design process that can be quickly adjusted and customized for each design.


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