The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

May. 05, 2022
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Xinshu Cai, Singapore, SG;

Yongshun Sun, Singapore, SG;

Kiok Boone Elgin Quek, Singapore, SG;

Khee Yong Lim, Singapore, SG;

Shyue Seng Tan, Singapore, SG;

Eng Huat Toh, Singapore, SG;

Thanh Hoa Phung, Singapore, SG;

Cancan Wu, Singapore, SG;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/103 (2006.01); H01L 21/8238 (2006.01); H01L 27/06 (2006.01); H01L 31/0224 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/103 (2013.01); H01L 21/823878 (2013.01); H01L 27/0629 (2013.01); H01L 31/022408 (2013.01); H01L 31/1824 (2013.01);
Abstract

A structure includes a photodetector including alternating p-type semiconductor layers and n-type semiconductor layers in contact with each other in a stack. Each semiconductor layer includes an extension extending beyond an end of an adjacent semiconductor layer of the alternating p-type semiconductor layers and n-type semiconductor layers. The extensions provide an area for operative coupling to a contact. The extensions can be arranged in a cascading, staircase arrangement, or may extend from n-type semiconductor layers on one side of the stack and from p-type semiconductor layers on another side of the stack. The photodetector can be on a substrate in a first region, and a complementary metal-oxide semiconductor (CMOS) device may be on the substrate on a second region separated from the first region by a trench isolation. The photodetector is capable of detecting and converting near-infrared (NIR) light, e.g., having wavelengths of greater than 0.75 micrometers.


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