The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Mar. 20, 2020
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Seunghwa Hyun, Suwon-si, KR;
Younghwan Kim, Seoul, KR;
Hwayoung Park, Hwaseong-si, KR;
Youngsu Ryu, Suwon-si, KR;
Yusang Cheon, Suwon-si, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); B05D 1/00 (2006.01); G01N 21/95 (2006.01); G03F 7/16 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); B05D 1/005 (2013.01); G01N 21/9503 (2013.01); G03F 7/162 (2013.01); H01L 21/67023 (2013.01);
Abstract
A semiconductor device manufacturing system includes a spin coater and a coating layer inspector. The spin coater includes: a chuck, a rotation driver configured to rotate the chuck; and a solution dispenser configured to spray a solution onto a portion of the coating layer formed on an edge portion of the wafer, wherein the coating layer inspector includes an edge inspection camera and an inspection controller configured to determine a radius, eccentricity, and a top-view shape of the coating layer, based on images of the edge portion of the wafer.