The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Nov. 08, 2021
Applicant:
Changxin Memory Technologies, Inc., Hefei, CN;
Inventor:
Shuai Guo, Hefei, CN;
Assignee:
CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/308 (2006.01); H01L 21/477 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67288 (2013.01); H01L 21/3086 (2013.01); H01L 21/477 (2013.01);
Abstract
A method for adjusting wafer deformation and a semiconductor structure are provided. The method includes the following operations. A deformation position and a deformation degree of a wafer are determined. At least one groove is formed at a back of the wafer according to the deformation position and the deformation degree. A stress film having a stress effect on the wafer deformation is formed at the back of the wafer with the at least one groove, and the stress film covers an inner wall of the at least one groove.