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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12051587 B1

PDFFull Text
Date of Patent:
Jul. 30, 2024

Filed:

Jun. 14, 2021

Substrate processing apparatus, estimation method of substrate processing and recording medium

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hiroshi Nakamura, Koshi, JP;

Masahide Tadokoro, Koshi, JP;

Masashi Enomoto, Koshi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Jiong-Ping Lu

Int. Cl.
CPC ...
H01L 21/02 (2006.01); B05C 5/02 (2006.01); B05C 11/00 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); H01L 21/302 (2006.01); H01L 21/306 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02343 (2013.01); B05C 5/022 (2013.01); B05C 11/00 (2013.01); G03F 7/162 (2013.01); G03F 7/2028 (2013.01); H01L 21/302 (2013.01); H01L 21/306 (2013.01); H01L 21/6708 (2013.01); H01L 21/6715 (2013.01); H01L 21/67253 (2013.01); H01L 21/67259 (2013.01); H01L 21/67276 (2013.01); H01L 21/67288 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); G03F 7/168 (2013.01);
Abstract

A substrate processing apparatus includes a periphery removal unit configured to remove a peripheral portion of a film formed on a surface of a substrate; a profile acquisition unit configured to acquire a removal width profile indicating a relationship between a position in a circumferential direction of the substrate and a width of a portion of the substrate from which the film is removed; and a factor estimation unit configured to output factor information indicating a factor of an error in the width based on the removal width profile.

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Nakamura, Hiroshi. (2024). Substrate processing apparatus, estimation method of substrate processing and recording medium (U.S. Patent No. 12051587). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12051587

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