The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Mar. 16, 2022
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Joseph Abel, West Linn, OR (US);

Purushottam Kumar, Hillsboro, OR (US);

Bart Van Schravendijk, Palo Alto, CA (US);

Adrien Lavoie, Newberg, OR (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/04 (2006.01); C23C 16/52 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45536 (2013.01); C23C 16/045 (2013.01); C23C 16/45565 (2013.01); H01J 37/32091 (2013.01); H01J 37/32394 (2013.01); H01L 21/0228 (2013.01); H01L 21/67069 (2013.01); H01L 21/76224 (2013.01); H01L 21/76837 (2013.01); C23C 16/52 (2013.01); H01J 37/321 (2013.01); H01J 37/32357 (2013.01); H01J 37/32724 (2013.01); H01L 21/6833 (2013.01);
Abstract

A plasma generating system generates plasma in a processing chamber. A controller is configured to: a) perform atomic layer deposition (ALD) N times to deposit film in a feature of the substrate; b) after performing a) M of the N times, supply an inhibitor plasma gas to the processing chamber and strike plasma in the processing chamber to create a passivated surface more on upper portions of the feature as compared to lower portions of the feature to inhibit the atomic layer deposition in the upper portions of the feature as compared to the lower portions of the feature; c) supply an etch gas to the processing chamber to etch the film more in the upper portions of the feature than in the lower portions in the feature of the substrate following b); and d) repeat a) to c) one or more times to gapfill the feature without voids.


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