The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2024

Filed:

Nov. 09, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Jonghae Kim, San Diego, CA (US);

Milind Shah, San Diego, CA (US);

Periannan Chidambaram, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/18 (2023.01); H01L 23/48 (2006.01); H01L 27/01 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49833 (2013.01); H01L 21/481 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 25/18 (2013.01); H01L 23/481 (2013.01); H01L 27/01 (2013.01);
Abstract

A reconstituted substrate, a packaged assembly comprising a reconstituted substrate, and methods for fabricating a reconstituted substrate. An example reconstituted substrate generally includes multiple package-level substrates implemented with different substrate technologies and held together. An example method for fabricating a reconstituted substrate generally includes forming multiple package-level substrates implemented with different substrate technologies, arranging the multiple package-level substrates, and adding a material to hold the multiple package-level substrates together.


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