The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2024
Filed:
Jul. 29, 2022
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Ying-Chih Hsu, Hsinchu, TW;
Wen-Shiang Liao, Miaoli County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a method of manufacturing a semiconductor device. The method includes forming an interconnect structure. In some embodiments, the forming of the interconnect structure includes forming a first patterned layer over a substrate, attaching a die attach film (DAF) to a permalloy device and transporting the permalloy device to the first patterned layer through a pick and place operation, forming a second patterned layer in the same tier as the permalloy device, and bonding a semiconductor die to the interconnect structure. In some embodiments, the second patterned layer is aligned with the first patterned layer, forming a third patterned layer over the second patterned layer and the permalloy device. In some embodiments, the first patterned layer, the second patterned layer and the third patterned layer collectively form a coil winding around the permalloy device.