The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2024
Filed:
Nov. 12, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventor:
Wen-Long Lu, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/16 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2023.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/16 (2013.01); H01L 21/4846 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/66 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 21/6835 (2013.01); H01L 24/16 (2013.01); H01L 2223/6616 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A semiconductor device package includes a substrate; an electronic component disposed on the substrate; multiple supporting structures disposed on the substrate; and a reinforced structure disposed on the supporting structures and extending in parallel with the substrate.