The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2024
Filed:
May. 14, 2021
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventor:
Chwen Yu, Taipei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/22 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
G01N 27/226 (2013.01); B81C 1/00531 (2013.01); G01N 27/227 (2013.01); B81C 2201/0143 (2013.01);
Abstract
The present disclosure provides a fluid sensor and a method for fabricating a fluid sensor. The fluid sensor includes a substrate including a first material and having a first surface and a second surface opposite to the first surface, wherein the substrate further comprises a recess recessed from the first surface, a first conductive layer over the first surface of the substrate, a protection layer between the first surface of the substrate and the first conductive layer, wherein the protection layer includes a second material, and a through via connected to the recess.