The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Jun. 15, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Terence Hook, Jericho Center, VT (US);
Brent A. Anderson, Jericho, VT (US);
Anthony I. Chou, Guilderland, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01L 23/522 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01L 23/5226 (2013.01); H01L 27/1203 (2013.01);
Abstract
A heat pipe is provided as an electrically inactive structure to dissipate heat that is generated by vertically stacked field effect transistors (FETs). The heat pipe is present in an electrically inactive device area which is located adjacent to an electrically active device area that includes the vertically stacked FETs. The heat pipe includes at least one vertical interconnect structure that continuously extends between each tier of the vertically stacked FETs.