The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2024

Filed:

Nov. 12, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sung Hoon Lee, Hwaseong-si, KR;

Gyuyeol Kim, Hwaseong-si, KR;

Yu-Kyum Kim, Hwaseong-si, KR;

Hanjik Nam, Seoul, KR;

Sehoon Park, Gwangju, KR;

Young Jun Park, Hwaseong-si, KR;

Seungwon Jeong, Yongin-si, KR;

Woojun Choi, Hwaseong-si, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07342 (2013.01); G01R 1/06727 (2013.01);
Abstract

A probe for testing a semiconductor device includes a post having a plate shape and connected to a test substrate. A beam has a first end connected to the post. A tip structure is connected to a second end of the beam. The post includes a front surface having a normal line extending in a first direction. A back surface is located opposite to the front surface. Bumps are disposed on the front surface and are spaced apart from each other. The beam extends in a second direction intersecting the first direction. Each of the bumps protrudes from the front surface in the first direction by a first length.


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