The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Sep. 25, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Nico Naas, Karlsruhe, DE;

Juergen D. Felleisen, Baden-Baden, DE;

Michael Windig, Rauenberg, DE;

Talal Arnaout, Walzbachtal, DE;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 5/00 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01); B60R 16/023 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1402 (2013.01); H05K 5/0026 (2013.01); H05K 7/2039 (2013.01); B60R 16/023 (2013.01);
Abstract

A stability device comprising a carrier having a first socket and a second socket; a first circuit board inserted into the first socket; a second circuit board inserted into the second socket, wherein an inside surface of the second circuit board is facing an inside surface of the first circuit board; a center structure positioned between the inside surface of the first circuit board and the inside surface of the second circuit board, wherein the center structure is fixed to the carrier via a stability bar fixed to the carrier; a spring loaded outer structure at least partially surrounding an outside surface of the first circuit board and an outside surface of the second circuit board and to fix the center structure between the inside surface of the first circuit board and the inside surface of the second circuit board, wherein the center structure and outer structure dissipate heat.


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