The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Aug. 23, 2021
Applicant:

Applied Materials Israel Ltd., Rehovot, IL;

Inventors:

Ilya Blayvas, Jerusalem, IL;

Yehuda Zur, Tel-Aviv, IL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/302 (2006.01); H01J 37/28 (2006.01); H01J 37/305 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3023 (2013.01); H01J 37/28 (2013.01); H01J 37/305 (2013.01); H01L 22/12 (2013.01); H01J 2237/24578 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/2814 (2013.01); H01J 2237/31749 (2013.01);
Abstract

Analyzing a sidewall of a hole milled in a sample to determine thickness of a buried layer includes milling the hole in the sample using a charged particle beam of a focused ion beam (FIB) column to expose the buried layer along the sidewall of the hole. After milling, the sidewall of the hole has a known slope angle. From a perspective relative to a surface of the sample, a distance is measured between a first point on the sidewall corresponding to an upper surface of the buried layer and a second point on the sidewall corresponding to a lower surface of the buried layer. The thickness of the buried layer is determined using the known slope angle of the sidewall, the distance, and the angle relative to the surface of the sample.


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