The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Jul. 09, 2020
Applicant:
Showa Denko K.k., Tokyo, JP;
Inventors:
Akira Furuya, Tokyo, JP;
Tadaaki Kojima, Tokyo, JP;
Hiroshi Suzuki, Tokyo, JP;
Fumiaki Naka, Tokyo, JP;
Assignee:
Resonac Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B32B 3/10 (2006.01); B32B 3/26 (2006.01); B32B 3/30 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); C23C 8/12 (2006.01); C23C 8/14 (2006.01); C23C 18/16 (2006.01); C23C 18/18 (2006.01); C23C 18/32 (2006.01); C23C 18/34 (2006.01); C23C 18/36 (2006.01); C23C 18/42 (2006.01); C23C 18/44 (2006.01); C23C 18/52 (2006.01); C23C 18/54 (2006.01); C23C 28/00 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01); C25D 3/12 (2006.01); H01J 37/32 (2006.01); C22C 38/44 (2006.01); C23C 16/44 (2006.01);
U.S. Cl.
CPC ...
C23C 28/322 (2013.01); B32B 3/10 (2013.01); B32B 3/266 (2013.01); B32B 3/30 (2013.01); B32B 15/01 (2013.01); B32B 15/015 (2013.01); B32B 15/017 (2013.01); B32B 15/018 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); C23C 8/12 (2013.01); C23C 8/14 (2013.01); C23C 18/1637 (2013.01); C23C 18/1651 (2013.01); C23C 18/1653 (2013.01); C23C 18/1689 (2013.01); C23C 18/1696 (2013.01); C23C 18/1848 (2013.01); C23C 18/32 (2013.01); C23C 18/34 (2013.01); C23C 18/36 (2013.01); C23C 18/42 (2013.01); C23C 18/44 (2013.01); C23C 18/52 (2013.01); C23C 18/54 (2013.01); C23C 28/02 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 28/028 (2013.01); C23C 28/321 (2013.01); C23C 28/345 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C25D 3/12 (2013.01); H01J 37/32477 (2013.01); C22C 38/44 (2013.01); C23C 16/4404 (2013.01); C23C 18/1824 (2013.01); Y10T 428/1259 (2015.01); Y10T 428/12597 (2015.01); Y10T 428/12604 (2015.01); Y10T 428/12611 (2015.01); Y10T 428/12618 (2015.01); Y10T 428/1266 (2015.01); Y10T 428/12667 (2015.01); Y10T 428/12743 (2015.01); Y10T 428/1275 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12889 (2015.01); Y10T 428/12931 (2015.01); Y10T 428/12937 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/12951 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/12979 (2015.01); Y10T 428/12993 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/24975 (2015.01); Y10T 428/249953 (2015.04); Y10T 428/26 (2015.01); Y10T 428/265 (2015.01);
Abstract
A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.