The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Feb. 09, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Navneet Singh, Bangalore, IN;

Samarth Alva, Bangalore, IN;

Amarjeet Kumar, Bangalore, IN;

Gaurav Hada, Bangalore, IN;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/4155 (2006.01); H01L 23/373 (2006.01); H01L 23/538 (2006.01); H01R 12/70 (2011.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G05B 19/4155 (2013.01); H01L 23/3736 (2013.01); H01L 23/538 (2013.01); H01R 12/70 (2013.01); G05B 2219/40269 (2013.01); G05B 2219/45031 (2013.01); H05K 1/181 (2013.01); H05K 2201/10378 (2013.01);
Abstract

An apparatus includes a memory interposer including a socket including an inner surface, one or more memories disposed on the inner surface, a bottom surface opposite to the inner surface, and pogo pins disposed on the bottom surface and respectively corresponding to the one or more memories, the pogo pins being configured to connect the one or more memories to a printed circuit board (PCB) including a semiconductor die. The apparatus further includes an intermediate thermal head attached to the memory interposer. The memory interposer is movable with respect to the intermediate thermal head.


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