The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Aug. 20, 2021
Applicant:

Wonik Ips Co., Ltd., Pyeongtaek-si, KR;

Inventors:

Dae Seong Lee, Dongducheon-si, KR;

Hyeon Beom Gwon, Seoul, KR;

Kyung Park, Seoul, KR;

Assignee:

WONIK IPS CO., LTD, Pyeongtaek-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/34 (2006.01); C23C 16/56 (2006.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 21/768 (2006.01); C23C 14/58 (2006.01);
U.S. Cl.
CPC ...
C23C 16/56 (2013.01); C23C 16/34 (2013.01); C23C 16/45534 (2013.01); C23C 16/45557 (2013.01); H01L 21/0228 (2013.01); H01L 21/02337 (2013.01); H01L 21/28185 (2013.01); H01L 21/28202 (2013.01); H01L 21/76856 (2013.01); C23C 14/5846 (2013.01);
Abstract

The present disclosure relates to a substrate processing method, and more particularly, to a substrate processing method for improving the physical properties of a thin film formed on a substrate. An embodiment of a substrate processing method according to the present disclosure comprises the steps of: carrying a substrate into a first chamber; a first pressurizing step increasing the pressure in the first chamber so that the pressure in the first chamber reaches a first high-pressure that is higher than the normal pressure; a first depressurizing step decreasing the pressure in the first chamber so that the pressure in the first chamber reaches a second high-pressure that is lower than the first high-pressure and equal to or higher than the normal pressure; a first pressurizing/depressurizing repeating step performing the first pressurizing step and the first depressurizing step repeatedly at a predetermined number of times; and a second depressurizing step decreasing the pressure in the first chamber so that the pressure in the first chamber reaches a first low-pressure that is lower than the normal pressure.


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