The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Nov. 16, 2021
Applicant:

Resonac Corporation, Tokyo, JP;

Inventors:

Naoyoshi Sato, Tokyo, JP;

Shuji Gozu, Tokyo, JP;

Minoru Kakitani, Tokyo, JP;

Takao Tanigawa, Tokyo, JP;

Ryuji Akebi, Tokyo, JP;

Chihiro Hayashi, Tokyo, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); C08J 5/18 (2006.01); C08J 5/24 (2006.01); C08L 35/00 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
C08L 35/00 (2013.01); C08J 5/18 (2013.01); C08J 5/24 (2013.01); H01L 23/145 (2013.01); C08J 2335/00 (2013.01); C08J 2347/00 (2013.01); C08J 2353/02 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01);
Abstract

The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) contains (A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600 and (A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more. The present invention also relates to a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.


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