The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

May. 20, 2020
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Keisuke Kamiki, Tokyo, JP;

Toru Maruyama, Tokyo, JP;

Yasuyuki Motoshima, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/015 (2012.01);
U.S. Cl.
CPC ...
B24B 37/015 (2013.01);
Abstract

The present invention relates to a temperature regulating apparatus for regulating a temperature of a polishing surface of a polishing pad used for polishing a substrate, such as a wafer. The present invention further relates to a polishing apparatus including such a temperature regulating apparatus. The temperature regulating apparatus () includes: a heat exchanger () having a heating flow passage () and a cooling flow passage () formed therein; a holder () arranged over the heat exchanger (); a coupling mechanism () configured to detachably fix the heat exchanger () to the holder (), the coupling mechanism () including: a first hook () fixed to an upper surface of the heat exchanger (); and a second hook () held by the holder (). The second hook () is configured to be able to be engaged with and disengaged from the first hook ().


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