The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Mar. 18, 2022
Applicant:
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Inventors:
Keun Soo Kim, Hsinchu, TW;
Yu Jin Jeon, Gyeonggi-Do, KR;
Mi Kyoung Choi, Incheon, KR;
Young Ik Kwon, Taichung, TW;
Assignee:
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 23/46 (2006.01); H01L 23/49 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/4882 (2013.01); H01L 23/3128 (2013.01); H01L 23/42 (2013.01); H01L 23/46 (2013.01); H01L 23/49822 (2013.01); H01L 25/105 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/161 (2013.01);
Abstract
In one example, a semiconductor device includes a substrate having a top side and a conductor on the top side of the substrate, an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, a lid covering a top side of the electronic device, and a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole. Other examples and related methods are also disclosed herein.