The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Jul. 26, 2022
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Yuan-Sheng Huang, Taichung, TW;
Ryan Chia-Jen Chen, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor structure and method of manufacturing a semiconductor structure are provided. The method includes receiving a substrate with fin features; forming a first gate stack over the substrate, wherein the first gate stack comprise at least one void exposed from a surface of the first gate stack; forming a fill material in the at least one void; partially removing the fill material outside the at least one void, wherein a portion of the fill material is left in the at least one void; forming sidewall spacers besides the first gate stack; removing the first gate stack; and forming a second gate stack.