The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Apr. 06, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Gurtej S. Sandhu, Boise, ID (US);

Sony Varghese, Manchester-by-the-Sea, MA (US);

John A. Smythe, Boise, ID (US);

Hyun Sik Kim, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); B29C 41/08 (2006.01); H01L 21/02 (2006.01); H01L 21/288 (2006.01); H01L 21/32 (2006.01); H01L 21/67 (2006.01); H01L 21/768 (2006.01); B29C 35/08 (2006.01); B29K 83/00 (2006.01); B32B 3/26 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7624 (2013.01); B29C 41/08 (2013.01); H01L 21/02216 (2013.01); H01L 21/02222 (2013.01); H01L 21/0226 (2013.01); H01L 21/02288 (2013.01); H01L 21/02631 (2013.01); H01L 21/288 (2013.01); H01L 21/76232 (2013.01); H01L 21/76837 (2013.01); H01L 21/76877 (2013.01); B29C 2035/0827 (2013.01); B29K 2083/00 (2013.01); B32B 3/266 (2013.01); H01L 21/32 (2013.01); H01L 21/6715 (2013.01);
Abstract

Some embodiments include a construction having a horizontally-extending layer of fluorocarbon material over a semiconductor construction. Some embodiments include methods of filling openings that extend into a semiconductor construction. The methods may include, for example, printing the material into the openings or pressing the material into the openings. The construction may be treated so that surfaces within the openings adhere the material provided within the openings while surfaces external of the openings do not adhere the material. In some embodiments, the surfaces external of the openings are treated to reduce adhesion of the material.


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