The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Nov. 24, 2020
Applicant:
Ibiden Co., Ltd., Gifu, JP;
Inventors:
Satoru Kawai, Ogaki, JP;
Yasuki Kimishima, Ogaki, JP;
Assignee:
IBIDEN CO., LTD., Ogaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/255 (2006.01); H01F 41/04 (2006.01); H01F 41/24 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/255 (2013.01); H01F 41/041 (2013.01); H01F 41/24 (2013.01); H01L 21/486 (2013.01); H01L 21/4864 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/645 (2013.01); H01F 2027/2809 (2013.01); Y10T 428/32 (2015.01);
Abstract
An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening of the core substrate and having a second through hole formed therein, a first through-hole conductor including a metal film formed in the first through hole of the core substrate, and a second through-hole conductor including a metal film formed in the second through hole of the magnetic resin. The magnetic resin includes a resin material and magnetic particles such that the metal film of the second through-hole conductor is in contact with the magnetic particles.