The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Jun. 30, 2022
Applicant:

Instrumental, Inc., Palo Alto, CA (US);

Inventors:

Samuel Bruce Weiss, Sunnyvale, CA (US);

Anna-Katrina Shedletsky, Sunnyvale, CA (US);

Simon Kozlov, Sunnyvale, CA (US);

Tilmann Bruckhaus, Sunnyvale, CA (US);

Shilpi Kumar, Sunnyvale, CA (US);

Isaac Sukin, Sunnyvale, CA (US);

Ian Theilacker, Sunnyvale, CA (US);

Brendan Green, Sunnyvale, CA (US);

Assignee:

Instrumental, Inc., Los Altos, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06F 18/213 (2023.01); G06F 18/40 (2023.01); G06V 10/25 (2022.01); G06V 10/40 (2022.01); G06V 10/771 (2022.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G06F 18/213 (2023.01); G06F 18/40 (2023.01); G06T 7/001 (2013.01); G06V 10/25 (2022.01); G06V 10/40 (2022.01); G06V 10/771 (2022.01); G06T 2207/30116 (2013.01); G06T 2207/30164 (2013.01);
Abstract

One variation of a method for monitoring manufacture of assembly units includes: receiving selection of a target location hypothesized by a user to contain an origin of a defect in assembly units of an assembly type; accessing a feature map linking non-visual manufacturing features to physical locations within the assembly type; for each assembly unit, accessing an inspection image of the assembly unit recorded by an optical inspection station during production of the assembly unit, projecting the target location onto the inspection image, detecting visual features proximal the target location within the inspection image, and aggregating non-visual manufacturing features associated with locations proximal the target location and representing manufacturing inputs into the assembly unit based on the feature map; and calculating correlations between visual and non-visual manufacturing features associated with locations proximal the target location and the defect for the set of assembly units.


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