The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Jul. 27, 2020
Toyo Kohan Co., Ltd., Tokyo, JP;
Shinichirou Horie, Kudamatsu, JP;
Etsuro Tsutsumi, Kudamatsu, JP;
Toshifumi Koyanagi, Kudamatsu, JP;
Shunki Obata, Kudamatsu, JP;
Michio Kawamura, Kudamatsu, JP;
Koh Yoshioka, Kudamatsu, JP;
Naoharu Harada, Kudamatsu, JP;
Tsuyoshi Irie, Kudamatsu, JP;
Yonosuke Yoshii, Kudamatsu, JP;
TOYO KOHAN CO., LTD., Tokyo, JP;
Abstract
[Object] To provide a roughened nickel-plated material in which the formation unevenness such as generation of the unevenness or grooves in a roughened nickel plated layer is restrained. [Solving Means] A roughened nickel-plated material including a base material that is a rolled material, and a roughened nickel plated layer formed on at least one surface of the base material, in which SRzjis of the surface of the roughened nickel plated layer is equal to or more than 2 μm, and, letting a maximum height of the roughened nickel plated layer be SRz, a valley region B in a given virtual planer region A as observed at a height position of SRz×0.25 satisfies the following (i). (i) The length of the valley region B in the rolling direction RD of the base material is less than 40 μm in a direct distance.