The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Apr. 09, 2019
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 35/02 (2006.01); C22C 13/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/0244 (2013.01); C22C 13/02 (2013.01);
Abstract
The present invention provides a solder paste that suppresses generation of voids and has excellent reliability. A solder paste contains Sn-based powder, SnSb-based alloy powder with Sn and 10 mass % or more of Sb, and flux, wherein a liquidus temperature of the SnSb-based alloy powder is higher than a liquidus temperature of the Sn-based powder, and a content ratio of the Sn-based powder and the SnSb-based alloy powder is 75:25 to 95:5. Preferably, the content ratio of the Sn-based powder to the SnSb-based alloy powder is 80:20 to 90:10.