The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Dec. 15, 2021
Applicant:
Coorstek Kk, Tokyo, JP;
Inventors:
Assignee:
COORSTEK GK, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); C01B 32/956 (2017.01); C01B 33/12 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68757 (2013.01); C01B 32/956 (2017.08); C01B 33/12 (2013.01); C01P 2006/90 (2013.01); H01L 21/67115 (2013.01); H01L 21/68735 (2013.01);
Abstract
The present invention relates to a semiconductor heat treatment member for holding a semiconductor wafer, including a base member a surface of which is covered with an oxide film, the base member including a silicon carbide, in which a surface of a wafer holding portion to be in contact with a semiconductor wafer has an arithmetic average roughness Ra of smaller than or equal to 0.3 μm and an element average length RSm of shorter than or equal to 40 μm.