The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Oct. 07, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Yuta Kunitake, Iwate, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G01H 9/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); G01H 9/00 (2013.01);
Abstract

A leak measurement system measures a leak of a semiconductor manufacturing apparatus. The leak measurement system includes a vibration sensor that contacts or is connected to the semiconductor manufacturing apparatus, an image generation unit that generates a vibration waveform image based on vibration data detected by the vibration sensor, and an analysis unit that analyzes the leak of the semiconductor manufacturing apparatus based on the vibration waveform image generated by the image generation unit.


Find Patent Forward Citations

Kunitake, Yuta. (2024). Leak measurement system, semiconductor manufacturing system, and leak measurement method (U.S. Patent No. 12014942). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12014942

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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