The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Jul. 22, 2022
Applicant:

Semes Co., Ltd., Chungcheongnam-do, KR;

Inventors:

Sung Ho Kim, Chungcheongnam-do, KR;

Yoon Ok Jang, Chungcheongnam-do, KR;

Bo Yeon Hwang, Chungcheongnam-do, KR;

Hyun Min Lee, Chungcheongnam-do, KR;

Kwang Jun Choi, Chungcheongnam-do, KR;

Assignee:

SEMES CO., LTD., Cheonan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/205 (2006.01); B41J 2/21 (2006.01);
U.S. Cl.
CPC ...
B41J 2/2054 (2013.01); B41J 2/2132 (2013.01); B41J 2/2142 (2013.01);
Abstract

A substrate processing apparatus and a substrate processing method are provided, which can improve the yield by minimizing the occurrence of stains. The substrate processing method includes forming on the substrate a plurality of ink patterns spaced apart from each other by jetting ink onto the substrate by using a plurality of nozzles, calculating the density of each of the plurality of ink patterns, and selecting at least one nozzle for jetting ink into one pixel area based on respectively calculated densities of the plurality of ink patterns.


Find Patent Forward Citations

Kim, Sung. (2024). Substrate processing apparatus and the method thereof (U.S. Patent No. 12011934). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12011934

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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