The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Nov. 12, 2021
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventor:

Wei-Hao Chang, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 21/78 (2006.01); H01L 21/82 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 25/162 (2013.01); H01L 21/78 (2013.01); H01L 21/82 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 24/12 (2013.01); H01L 24/15 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/072 (2013.01); H01L 25/074 (2013.01); H01L 25/165 (2013.01); H01L 21/6836 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate disposed over the first substrate and having a first surface facing away from the first substrate and a second surface facing the first substrate, a first component disposed on the first surface of the second substrate, a second component disposed on the second surface of the second substrate; and a support member covering the first component.


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