The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2024
Filed:
Aug. 10, 2021
Applicant:
Changxin Memory Technologies, Inc., Anhui, CN;
Inventor:
Ping-Heng Wu, Hefei, CN;
Assignee:
Changxin Memory Technologies, Inc., Hefei, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/03 (2013.01); H01L 2224/05026 (2013.01); H01L 2224/05082 (2013.01); H01L 2924/351 (2013.01);
Abstract
A semiconductor structure and a forming method thereof are provided. The method of forming the semiconductor structure includes: providing a wafer having a front surface and a back surface opposite to the front surface; patterning the back surface of the wafer to form a groove extending from the back surface towards the front surface; forming a dielectric layer at a bottom and a side wall of the groove; and forming, on the dielectric layer, a conductive layer filling the groove.
Wu, Ping-Heng. (2024). Semiconductor structure and method for forming semiconductor structure (U.S. Patent No. 12009324). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12009324
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile