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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12009315 B1

PDFFull Text
Date of Patent:
Jun. 11, 2024

Filed:

Sep. 03, 2020

Component carrier structure connectable by electrically conductive connection medium in recess with cavity having surface profile

Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventor:

Abderrazzaq Ifis, Leoben, AT;

Assignee:

AT&SAustria Technologie & Systemtechnik AG, Leoben, AT;

Attorneys:

Robert A. Blaha

Smith Tempel Blaha LLC

Primary Examiner:

Phat X Cao

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4857 (2013.01); H01L 21/4867 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/49883 (2013.01);
Abstract

A component carrier with a first component carrier structure including a first stack which has at least one first electrically conductive layer structure and at least one first electrically insulating layer structure is disclosed. The at least one first electrically conductive layer structure has a first contact element which extends up to a first contact surface of the first stack. An electrically conductive connection medium is directly connected to the first contact element at the first contact surface by filling at least one recess of the first contact element. The at least one recess having a larger dimensioned cavity delimited by a smaller dimensioned surface profile.

Find Patent Forward Citations

Ifis, Abderrazzaq. (2024). Component carrier structure connectable by electrically conductive connection medium in recess with cavity having surface profile (U.S. Patent No. 12009315). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12009315

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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